Intel has announced its new family of mobile baseband chipsets in the X-GOLD 706, XMM 2138 and the XMM 6260 with the X-GOLD 706 supporting LTE, the XMM 6260 supporting HSPA+ 21Mbps data access and the XMM 2138 supporting Dual SIM Dual Standby support for emerging markets.
Intel states that the 706 is based on the X-GOLD 626 architecture with additional support for LTE on the older 6260 baseband design for maximum flexibility for manufacturers as well. Intel believes the 706 baseband processor will be ideal for smartphones and tablets. Intel also introduced a new HSPA+ chipset that is capable of 21Mbps download speeds in the XMM 6260, also based on the 6260 architecture with both chips using 40nm process manufacturing.
The last major announcement concerns the burgeoning dual SIM market with the XMM 2138 chipset which supports WQVGA resolution displays, touch displays, Bluetooth and Wi-Fi, with sampling and manufacturing underway.
